Signal Integrity Simulation for SiP Using GTLE
Signal integrity (SI) simulation for system-in-package (SiP) is a bottleneck in SiP design flow. This paper presents a novel numerical algrothm for SI simulation in packaging structure. This algorithm is based on 2D Generalized Transmission Line Equation (GTLE), Finite Difference Time Domain (FDTD) and mesh division technique. SI is simulated using mesh division technique where the model of SI is obtained by regarding each cell as a 2D transmission line. 2D GTLE is a group partial equation about voltage and current density distribution on a power/ground plane pair. After reduction, the voltage equation for 2D GTLE is obtained, which is a wave equation. One method to solve the wave equation is by the finite-difference scheme. In this paper, the fringe effect and absorbing boundary condition is applied to implement the wave equation efficiently and easily. Three test cases are presented to explain the solution of the wave equation. The methodology described in prior section has been implemented in a CAD tools. The results from our method were compared to those from the full-wave simulator to show efficiently in signal integrity simulation.
Jia Jia liqiang Cao lixi Wan
Institute of Microelectronics, Chinese Academy of Science, Beijing, 100029, China
国际会议
上海
英文
468-470
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）