The Electrical Design of High-speed and High-density ASIC Package
This paper introduces a package of a high-speed and high-density switching ASIC with over 1000 pins and hundreds of high-speed transmission lines crowded in two layers of the substrate, and also demonstrates Signal Integrity (SI) and Power Integrity (PI) implementation. In order to route the transmission lines with minimum distortion, crosstalk and attenuation, routing is co-designed with die and BGA maps. To guarantee that over a hundred transmission lines will be matched identically, each transmission line is designed to have a corresponding continuous return path routed among integrated copper shapes. Various routing schemes designed to take advantage of the physical and electrical performance of materials and structures are also implemented to optimize the performance of the transmission line. Various simulations are carried out on test segments to evaluate performance and signal integrity in the frequency and time domains.
Wenjun Tao Jun Li Yunyan Zhou Qidong Wang Liqiang Cao Daniel Guidotti Lixi Wan
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
国际会议
上海
英文
497-499
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）