Molecular Dynamics Simulation for the Bonding Energy of Metal-SWNT Interface

摘要：

For this paper, we carried out molecular dynamics simulation to calculate the bonding energy of the metal-SWNT interface. Three kinds of metal, namely iron, nickel and gold, were studied. The results show that the iron-SWNT interface has the strongest bonding energy, and then nickel and gold. To confirm these results, tensile loading tests were also performed to study the breaking force of the metal-SWNT interface. The force needed to debond the metal-SWNT interface is at the order of nano-newton. The more adhesion energy the interface has, the bigger force that must be loaded to break the joint.

作者: Yahui Zhang Zhili Hu Yan Zhang Lilei Ye Johan Liu

作者单位: Key Laboratory of Advanced Displays & System Applications, Ministry of Education and SMIT Center, Sc Key Laboratory of Advanced Displays & System Applications, Ministry of Education and SMIT Center, Sc SHT -Smart High Tech AB, Fysikgrand 3, 412 96, Goreborg, Sweden

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 506-509

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）