A Constitutive Model for Lead-free Solders Considering the Damage Effect at High Strain Rates

摘要：

The rate-dependent Johnson-Cook material model can predict the stresses and strains of lead-free solder when the strain rate is relatively low (600 s-1). At higher strain rates (1200 s-1 or above), the stress-strain curves predicted by Johnson-Cook model do not agree well with the experimental results when the strain exceeds a threshold value. In this paper, the damage effect is considered into the impact process of lead-free solder specimens.

作者: WANG Xuming QIN Fei AN Tong

作者单位: College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology, Beijing 100124, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 510-513

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）