Influence of Interfacial Delamination on Temperature Distribution of QFN Packages

摘要：

Infrared thermography has become increasingly important for non-destructive testing to detect internal defections, involving delaminations, cracks and voids. In this paper, the principle of infrared thermography is presented briefly. And a finite element approach is proposed to simulate the process of infrared thermography nondestructive testing about QFN packages. By changing with the length and the thickness of the delamination and the size of uniform surface heat flux, the surface thermal characteristics of a QFN are analyzed. The simulation results can provide basis and reference for the following work to detect defects in packages by infrared thermography method

作者: BAN Zhaowei QIN Fei AN Tong XIA Guofeng LIU Chengyan

作者单位: College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 519-522

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）