Morphology and Nanoindentation Properties of Intermetallic Compounds in Solder Joints

摘要：

The growth of intermetallic compounds (IMC) at the Sn3.0Ag0.5Cu/Cu interface is investigated under aging temperature of 150 ℃ and aging time of 100, 300 and 500 hours. The relationship between the thickness of the IMC and aging time is fitted out, and the growth law of the IMC at Sn3.0Ag0.5Cu/Cu interface under isothermal aging condition is obtained. Mechanical properties of the Cu6Sn5 and Cu3Sn are obtained by a G200 nanoindentation tester. It indicates that with the Cu6Sn5 thickness increases, its Youngs modulus and hardness have no change. The Youngs modulus of Cu3Sn is greater than that of Cu6Sn5, but the hardness of Cu3Sn is lower than that of Cu6Sn5. The nanoindentation experiments of the Sn3.0Ag0.5Cu/Cu interfacial zone show that the hardness of Cu, Cu3Sn, Cu6Sn5 and Sn3.0Ag0.5Cu has an order in magnitude of Cu6Sn5>Cu3Sn>Cu>Sn3.0Ag0.5Cu.

作者: ZHONG Weixu QIN Fei AN Tong LIU Chengyan

作者单位: College of Mechanical Engineering and Applied Electronics Technology,Beijing University of Technology, Beijing 100124, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 523-528

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）