Modeling and Finite-Element Full-wave Simulation of Glass Interposer with TGVs (Through-Glass-Vias) for 3D Packaging
A glass interposer with through-glass-via (TGV) is desirable for three-dimensional system-in-package (3D SiP) integration in order to implement product miniaturization, high density, high performance and integration of different functional chips with minimal signal propagation delay. Based on microwave transmission line theory and coplanar waveguide (CPW) theory, a finite element, full-wave method was used to simulate and analyze the transmission characteristics of TGV vertical interconnections in a glass interposer. The effect of the variations in the TGVs diameter and height, as well as the effect of coupling between two TGVs in the same layer and different layers were studied. Additionally, transmission S21, return loss S11 and electric field distributions are displayed.
Jing Zhang Xiaofeng Sun Guidotti Daniel Daquan Yu Liqiang Cao Lixi Wan
Institute of Microelectronics, Chinese Academy of Sciences NO.3, Bei-Tu-Cheng West Road, Beijing 100029, China
国际会议
上海
英文
533-536
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）