Ultra-Wideband Noise Isolation on Power Distribution Network of High-speed Package Substrate

摘要：

This paper presents an effective power noise isolation and suppression method in high-speed package substrates, which is based on planar electromagnetic bandgap (EBG) in local area of power/ground plane and embedded capacitor material between the power and ground planes. Compared with the performance of continuous power and ground planes, the proposed structure provides greater than -40dB isolation in S-parameter simulation at frequency above 1GHz, and shows excellent isolation (-70～-140 dB) from 2GHz up to over 30 GHz frequency range. The structure can be used to minimize the risk of power noise interference between different dies from a shared power supply system in board or out of board.

作者: Baoxia Li Lixi Wan

作者单位: Institute of Microelectronics of Chinese Academy of Sciences No.3.Bei-tu-cheng West Road, Beijing, China 100029

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 537-540

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）