Power Integrity Simulation for Multilayer Power Distribution Networks Based on GTLE and Via Model
In high-speed applications, electronic packages usually contain multilayer power-ground planes with large number of P-G vias to provide a low-impedance path for the power distribution system between the PCB and the die. The transient current injected into the P-G planes can induce unintentional voltage fluctuations in the power distribution network of the packages. The undesired voltage fluctuations can be significant even for the packages with solid P-G planes due to the return currents of switching input/output lines. A major problem arising in power distribution networks is simultaneous switching noise (SSN) which is induced by the power and ground inductance. This paper presents a numerical approach that combines the 2D generalized transmission line equations (GTLE) method and multi-layer finite-difference frequency-domain (FDFD) method to model and analyze the two-dimensional electromagnetic problem arising in multilayered power distribution planes. The results of our analysis method are compared to those from a full-wave simulator to show efficiency in power integrity simulation.
Yunyan Zhou Lixi Wan Shuhua Liu Liqiang Cao Jia jia
Institute of Microelectronics, Chinese Academy of Sciences, Beijing, 100029, China
国际会议
上海
英文
545-548
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）