ibration and Bondability Analysis of Fine-pitch Cu Wire Bonding
In this paper a novel simulation procedure combining dielevel vibration analysis and transient simulation of free air ball (FAB) and multi-layer pad structure subjected to impact and ultrasonic load from capillary are developed. In transient wire bonding simulation, substrate, dies and die adhesive of package are modeled using support springs in which the corresponding spring coefficients represented deformable characteristics of die stacking structure are obtained from dielevel vibration analysis. Natural frequencies and stiffness matrixes of stacked dies structure with different overhang lengths as well as plastic works of wedding surfaces of FAB and pad are carried out numerically to evaluate their bondabilities. Experimental tests are also carried out. The results show that stiffness of stacked dies structure and plastic work of pad structure have significant effects to copper (Cu) wire bondability.
Chang-Lin Yeh Ying-Chih Lee Yi-Shao Lai
Production Solution, Corporate R&D, Advanced Semiconductor Engineering, Inc.26 Chin 3rd Rd., Nantze Export Processing Zone Nantze 811, Kaohsiung, Taiwan, China
国际会议
上海
英文
577-583
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）