A new RF Capacitive Accelerometer Embedded in LTCC Packaging Substrate
(0) Based on the former works, this paper demonstrates a new way in making RF capacitor accelerometer based on LTCC substrates, which resist high temperature to a great extent. Moreover, as many parts in an automobiles and aeroplane, such as engine, bearing and gear would dissipate much heat, thus we decided to use LTCC to encapsulate the sensor. We utilized Anslys to run the simulation work, so as to validate the effective of he structure in practical use. In the mean time , we analysis its accuracy, as well as processing the theoretical derivation to consummate our design. The results turn out that the performance of the structure packaged by LTCC overweigh the material of silicon, and its detailed mechanical properties will be illustrated.
Cao Rui Wang Zhe Gan Hua Jia Songtao Min Miao Yufeng Jin
National Key Laboratory on Micro/Nano Fabrication, Peking University, Beijing 100871, P.R.China Departments of Electronic Engineering, Tsinghua University, Beijing National Key Laboratory on Micro/Nano Fabrication, Peking University, Beijing 100871, P.R.China Info
国际会议
上海
英文
655-657
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）