SMD Reliability Research Base on Stolkarts Fatigue Model
The article mainly focus on the reliability of the solder joints between the PCB and SMD in the situation like transporting and restoring, etc, provide theory evidence to enhance the reliability of such devices, ANSYS simulation tool serviced for modeling PCB, SMD and the joint structures, analyzed the maximum and the minimum stress position of the model, lower stress was loaded on the model to simulate the transferring action，then based on the Stolkarts fatigue model to predict the lifetime of these components，calculated the theory lifetime of the model，compared with the experiment，finally proved that Stolkarts fatigue model has actual ability to calculate the lifetime of devices which under certain stress value.
Zhao Wang Heming Zhao Wenzhong Lou Hanwei Li Li Jin
School of Electromechanical Engineering, North university of China No.3 Xueyuan Road, Taiyuan, Shanx National Key Laboratory of Electromechanical Technology, Beijing Institute of Technology No.8 Zhongg
国际会议
上海
英文
673-676
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）