Study on the Heat Dissipation of the Thermal Via in T/R Modules Based on BP-GA
Thermal via which widely is used in chips and the PCB is a strong way to transfer heat. But at the same time, Thermal via settings take up assembly space, so the parameters of thermal via must be optimized. This paper makes the predictive value as the fitness value, use the BP-GA hybrid algorithm, through optimizing the number, pitch and diameter, to get the lowest chip junction temperature. It is concluded that the junction temperature of T/R modules chip change from 54.206℃ to 52.097℃ by adding thermal via Settings. The temperature is reduced 2.109 ℃. It shows that thermal via Settings effectively lower the junction temperature of the chips, improving devices using life. This paper contributes guiding significance on thermal design of the T/R modules.
Tang-wen Bi De-jian Zhou
School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guangxi School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guangxi
国际会议
上海
英文
688-690
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）