Silver Nitric-An Innovative Process Indicator for Oxidation of PCB with OSP Finish

摘要：

Oxidation on PCB due to shelf life and environment stresses is a severe problem in the soldering process. In this article, the chemical agent of Silver Nitric is used to react with OSP coated-cupper pad. By measuring the time to discoloration, the severity of oxidation can be quantitatively classified by solder wettibility. Variables such as storage time, temperature & humidity, reflow cycles are adapted as preconditioning to emulate shelf life and environment stress and to use as failure precipitation mechanism for oxidation on cupper pad. Using discoloration as an innovative process indicator, the hardening of OSP coating can also be reviewed.

作者: Eric Hou DF Chung Paul Wang

作者单位: Mitac International Inc., ShunDe China No.1 Shunda Road Lunjiao Street, Shunde District, Foshan City Guangdong Province CHINA.528308

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 703-707

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）