Void Mechanism Research and Control in Solder Joint

摘要：

Void formation mechanism was studied and so were the key factors for SMT voids. 2 kinds of solders (SAC305 & SnPb) and 2 kinds of pad finishes (ENIG and OSP) were compared. Key factors of reflow profile were also evaluated. Reflow atmosphere were evaluated to observe the effects on void. Stencil thickness on void formation was also studied. Results show that by adjusting all these factors, the maximum void size and void quantity can be controlled. It is also found that using higher melting point solder ball and lower melt point solder paste together will get void-free SMT result which also impresses the understanding of void forming mechanism: Gas of reaction and volatilization is trapped by melted solder particles in solder paste and form voids.

作者: Xie Xiaoqiang Zhou Jianwei Chae Jonghyun Chung Myungkee

作者单位: Samsung Semiconductor China R&D No.15, Jin Ji Hu Road, Suzhou Industrial Park, Suzhou, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 725-728

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）