The Stress-Strain Behaviors of Solder Joints During Thermal Fatigue Process

摘要：

By means of establishing experimental model, the mechanical behavior and changes in basic parameters of new Sn-Zn system lead-free solder joint in thermal fatigue process were studied, and using the result to evaluate the performance of this new type of lead-free solder, providing the accurate boundary conditions for the reliability estimation methods (finite element analysis) of solder. This study of solder joint reliability and life assessment in thermal fatigue process has very important theoretical and practical significance.

作者: Geng Zhiting Heqing Cheng Guohai Ma Jusheng

作者单位: School of Energy and Power Engineering, North China Electric Power University, Beijing, 102206, Chin School of Energy and Power Engineering, North China Electric Power University, Beijing, 102206, Chin Department of Materials Science and Engineering, Tsinghua University, Beijing, 100084, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 764-767

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）