Residual Stress Estimation of NCF-Bonded COG Packages during Manufacturing Process
Nonconductive film (NCF) is more and more used for chip-on-glass (COG) bonding instead of anisotropic conductive film (ACF), due to its advantages of finer bump pitch and cost reduction. However, the chemical reaction of NCF requires, and experiences show that excessive warpage and residual stress will usually be induced because NCF curing requires higher temperature and bonding pressure than ACF, which is one of the major reliability problems encountered in industry. In this paper, an internal force analysis model of the metal-coated polymer bump is presented, and the effect of bonding parameters on residual stress is investigated, and an improved ZGSs mechanical model, characterizing various viscoelastic behaviors of polymer, is proposed to estimate the residual stress in metal-coated polymer bumps. After that, the effects of NCFs material properties and the bonding parameters on the deformation and residual stress distributions are discovered.
Jie Guo Bo Tao Zhouping Yin
State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology 1037 Luoyu Road, Wuhan, China
国际会议
上海
英文
777-782
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）