Analysis of Temperature Field of Embedded Multi-Chip Module

摘要：

For the Embedded Multi-Chip Module, the placement of the chip directly affects the internal temperature distribution, thereby affecting the reliability. In this paper, taking Embedded Multi-Chip Module as the research object, using ANSYS software to establish embedded type MCM model, performing finite element analysis of Embedded Multi-Chip Module temperature field under the condition of different substrates, different air convection coefficient and the use of heat sink, obtaining temperature distribution of Embeddedtype MCM. The results show that different substrates and different air convection coefficient will affect the chip temperature distribution; using heat sink can significantly reduce the chip temperature.

作者: Huang Chunyue Wang Bin Li Tianming Wei Hegeng

作者单位: School of Electro-Mechanical Engineering, Guilin University of Electronic Technology, Guilin 541004, Department of Automobile and Power Engineering, Guilin College of Aerospace Technology, Guilin 54100

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 801-805

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）