Size and Volume Effects in Microscale Solder Joint of Electronic Packaging

摘要：

Due to the size and volume of solder joint interconnection in electronic packaging structures continue to be much smaller and smaller, many properties and behaviors of microscale solder joints are obviously different from those of bulk solder materials, that is, so-called solder joint size/volume effects occurs for the ever-increasing miniaturization trend of modern electronic products. In this paper, the influence of solder size and volume on the intermetallic compounds (IMCs) formation reaction (i.e., interfacial reactions), growth, evolution at the solder/substrate interface and the mechanical properties (e.g., tensile property, shear property, creep property and fatigue property) of microscale solder joint interconnections were reviewed. In addition, a few development trends of size and volume effects in electronic packaging were also proposed.

作者: Li-Meng Yin Wang-Yun Li Song Wei Zhang-Liang Xu

作者单位: School of Metallurgy and Materials Engineering, Chongqing University of Science and Technology Chongqing, 401331, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 832-834

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）