Correlation between Ag Content and Cu Pad Consumption in Lead–Free Solder Joints under Electron Current Stressing

摘要：

White tin (or β-Sn) has a bodycenter tetragonal (BCT) crystal structure with lattice parameters of a=b=5.83 (A) and c=3.18 (A). We found that the orientation of the β-Sn phase strongly correlated with the Ag content in the SnAgCu solder joints. When the Ag content is equal to or greater than 3 wt.%, the Sn grains display a strong preferred orientation of the caxes in the direction parallel with the interface (or perpendicular to the electron flow upon current stressing) that substantially reduces the pad consumption induced by electromigration. A more detailed analysis through electron backscatter diffraction (EBSD) on the β-Sn grain orientation with respect to the pad consumption is established in this study.

作者: C.N.Chen B.Z.Chen W.H.Wu C.E.Ho

作者单位: Department of Chemical Engineering & Materials Science, Yuan Ze University 135 Yuan-Tung Road, Jhong-Li

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 846-850

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）