SOP Package Surface Discoloration after PCT Test

摘要：

Although the new assembly technology is developed well in this recent era, the conventional surface mount package technology such as dual-side small-outline package (SOP) is still useful to the common commercial IC products. If the IC products will be delivered to the market, they must pass the reliability tests such as the pressure cook test (PCT). Unfortunately, some tested products depicted an outlook of metal migration on the surface of the packaged ICs after this product reliability test. The stressed ICs with discoloration showed a function fail.

作者: Mu-Chun Wang Hsin-Chia Yang Chuan-Hsi Liu Ren-Hau Yang

作者单位: Department of Electronic Engineering, Minghsin University of Science and Technology, Hsinchu, Taiwan Department of Mechatronic Technology, National Taiwan Normal University, Taiwan.China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 855-858

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）