Study on the Adhesion and Reliability of Epoxy Molding Compound and Shaped Pd Preplated Leadframes
The weak adhesion between the Epoxy Molding Compound (EMC) and Pd Preplated leadframes (Pd PPFs) often causes delaminations and reduces the reliability of integrated circuit. This paper reports on a practical method of dramatically improving the adhesion of EMC and Pd PPFs using electroplating shaped nickel layers. Button shear tests indicate that the adhesions between the EMC and three different shaped nickel PPFs is 169% higher than that of conventional PPFs. The reliability of the adhesion improvement effects was detected by Moisture Sensitivity Level 1(MSL-1) test and high temperature button shear test, which proved the high reliability of the shaped PPFs. The mechanical interlocking effects caused by increased surface roughness are the major reason for the improved adhesion as well as the transition of failure modes from adhesive failure to cohesive failure.
Mingzhi Ni Wenjing Zhang Ming Li Dali Mao
Shanghai Jiao Tong University 800, Dongchuan Road, Shanghai, China 200240
国际会议
上海
英文
884-887
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）