Corrosion of Sn-0.75Cu Solder and Sn-0.75Cu/Cu Joint in Salt Solutions

摘要：

The corrosion of Sn-0.75Cu solder and Sn-0.75Cu/Cu joint in 3.5% NaCl, 1%NaCl-2%Na2SO4 and 1%NaCl-0.6%Na2SO4-3%Na2CO3 solutions were investigated using leaching test. The leaching of Sn from the solder in 1%NaCl-0.6%Na2SO4-3%Na2CO3 solution was relatively serious, compared to that in the other two solutions. The amount of Sn leached from the joint was the largest in NaCl solution. Loosen corroded products formed on the surfaces of the solder or joint where a large amount of Sn leached. The XRD results showed that the corrosion products were mainly composed of SnO, SnO2 and Sn4(OH)6Cl2. The potentiodynamic polarization tests suggested that the galvanic corrosion which formed between solder alloys and Cu substrate was the main reason for the above differences.

作者: Yanfang Gao Yanfang Gao Mingliang Huang Mingliang Huang Jie Zhao

作者单位: School of Materials Science and Engineering, Dalian University of Technology Dalian, 116085 China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 916-919

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）