Drop Impact Test on High Power Light Emitting Diodes Module
In this study, reliability performances of high power light emitting diodes module subjected to drop test conditions are evaluated experimentally. Firstly, we have a theoretical analysis of the impact dynamic progress for the LED module. Secondly, a series of impact tests for LED module are also carried out by a self-made microelectronic drop tester. The good reproducibility of dynamic parameters such as impact force, and acceleration as a function of time are recorded for evaluating the impact response through the signal processing. Finally, we can conclude that the theoretical analysis is effective and the self-made drop tester is relatively precise by comparing the theoretical and experimental results. The main failure modes of LED module are lens off and crack formation in the impact experiment. The failure mechanisms of LED modules are analyzed in order to guide the design of LED light package modules.
Tao Peng Xuefang Wang Mingxiang Chen Run Chen Sheng Liu
Institute for Microsystems, School of Mechanical Science and Engineering, Huazhong University of Science & Technology, Wuhan, 430074, China Division of MOEMS, Wuhan National Lab for Optoelectronics, Wuhan, 430074, China
国际会议
上海
英文
928-931
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）