Crosstalk Analysis and Optimization of High-Speed Interconnections

摘要：

Crosstalk noise has become a major performance inhibitor in high speed digital system. This is especially the case in package designs, connector assemblies and circuit interconnects designs. With the simultaneous miniaturization of electronic systems and decreasing signal rise time, it is important to be able to predict major sources of crosstalk and to stay within the cross-talk budget for high-speed interconnects interfaces. In this paper, first, we focus on analyzing the crosstalk mechanism. Second, based on simulation, we propose methods to minimize crosstalk.

作者: Haidong Wang Jian Song Fengman Liu Haifei Xiang Wei Gao Lixi Wan

作者单位: Institute of Microelectronics of ChineseAcademy of Sciences B415,3#,BEITUCHENGWest, CHAOYANG District, Beijing, 100029, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 963-966

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）