An Advanced High Speed Solder Ball Impact Method and Its Operation System
An advanced high speed solder ball impact tester (BIT) was developed together with its operation system based on the industrial demand of solder joint reliability tests. Different from the previous approaches, by applying some novel mechanical and software designs, this unique BIT system is able to perform precise high speed solder ball impact tests and automatic data analysis to fulfill the users’ requirements. In this work, the methods that this BIT system used to overcome existing problems in former BIT designs are introduced. The performance of the BIT has been evaluated in the impact tests on SAC105 and SAC305 solder joints. By utilizing this BIT, ram height changes without violating the JEDECs standards is proved to be trivial for SAC305 solder joint under high speed impact.
Yanbo Zhang Zheming Zhang Haibin Chen Neil Mclellan Jingshen Wu
Department of Mechanical Engineering Center for Engineering Materials and Reliability (CEMAR)Hong Kong University of Science and Technology Clearwater Bay Road, Kowloon, Hong Kong, China
国际会议
上海
英文
976-981
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）