Failure Analysis Techniques for High Power Light Emitting Diodes
As the most promising candidate for the realization of high-efficiency light sources for general lighting, the high power lighting emitting diodes(HP-LEDs) still have reliability issues that hinder the large scale application of LED devices. Nowadays, the reliability is becoming an essential barrier for LED devices to substitute the traditional light sources. Failure analysis is one of the key approaches to improving the reliability of LED products. In this paper, three techniques, namely fluorescent penetrant inspection (FPI), chemical decapsulation and Nano-CT scanning, which are usually applied in other fields, are proposed as major failure analysis tools. Both of their advantages and disadvantages are also recommended, and then combining fluorescent penetrant inspection (FPI) and chemical decapsulation with field scanning electron microscope (FSEM) to analyze the failure modes of one LED sample undergoing 200 thermal shock cycles, and find the fracture of gold wire is attributed to excessive tensile stress of shrink of silicone encapsulations.
Run Chen Qin Zhang Tao Peng Feng Jiao Sheng Liu
Institute of Microsystems, Stat Key Lab for Digital Manufacturing Equipment & Technology, School of Mechanical Science and Engineering, Huazhong University of Science & Technology, Wuhan, 430074, China Division of MOEMS, Wuhan National Lab for Optoelectronics, Wuhan, 430074, China
国际会议
上海
英文
982-985
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）