Sample Preparation Device for Molding Compound Adhesion Test

摘要：

Moisture ingression in plastic packages generally occurs through delaminated interfaces between different materials. So the adhesion strength between molding compound and substrate is crucial to the plastic package reliability. In the present work, a sample preparation device was designed for molding compound adhesion test. A series of experiments has been done with this device. The results showed that the data obtained with this device was stable. The data fluctuation was relatively small. The sample preparation device was effective in molding compound adhesion test.

作者: Qin Lu Wenjing Zhang Ming Li Dali Mao

作者单位: School of Materials Science and Engineering, Shanghai Jiao Tong University 800 Dongchuan Road, Shanghai, China

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 997-999

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）