Reliability Study on High Power LED with Chip on Board
In this paper the reliability of high power LED street lamp subjected to temperature cycle is analyzed. Two kinds of finite element models of LED street lamp structure with 60W input power are established by using ANSYS software. The temperature cycling condition from -5℃to 50℃ is loaded. The increasing and decreasing rate of temperature is 5℃ /min and the holding time is 30 minutes. This process is consisted of 8 cycle periods and returns to room temperature 25℃ for initial temperature. The results demonstrate the deformation of integrated LED street lamp structure can reach 2.17μm while that of LED lamp array is only 5nm. The results provide the basic for further study on LED street lamp failure mechanism and reliability design for LED street lamp.
Dongjing Liu D.G.Yang Rongbin Ren Fengze Hou Chao Huang
Guangxi Key Laboratory of Manufacturing System & Advanced Manufacturing Technology School of Mechanism and Electrical Engineering Guilin University of Electronic Technology, Guilin, China
国际会议
上海
英文
1004-1007
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）