Reliability Test and Simulation Analyses for High Power LED

摘要：

High power LED products intended for outdoor applications need specific tests to evaluate its reliability. In this paper acceleration tests for LED samples at high temperatures and currents below the rating conditions, have been carried out. Considering the high junction temperature of LED chip is the main reason which caused the decreased optical efficiency output, and the typical failure models for degradation of optical efficiency have been analyzed by reliability tests and simulation.

作者: Zhu Weitao Pan Kailin Ren Guotao Huang Jing

作者单位: School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology No.1 Jinji Road, Guilin, China, 541004

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 1022-1025

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）