Study into High Temperature Reliability of Isotropic Conductive Adhesive
With the rapid development of technologies for high density assembly and packaging in electronic industry, isotropic conductive adhesive (ICA) has been paid more and more attention as a potential substitute for solder, due to its advantages of low processing temperature, simple processing conditions and good manufacturability. However, studies into the reliability of ICA are not as abundant as those of solder. As a composite material, the failure feasibility of ICA not only depends not only on the variation in performance of different constituent parts, such as high temperature aging of the polymer, aging due to moisture absorption and oxidization of filler particles, but also on interface changes. Thus, the failure mechanism of ICA seems to be complicated and studies into the reliability of ICA are also necessary. Reliability in humidity and heat has been investigated in previous works, and in this paper high temperature reliability will be studied as a comparison. Some reliability tests and results will be given and some failure mechanisms discussed. Finally, we present some discussion about the further optimization of reliability for follow-up studies.
Wenhui Du Huiwang Cui Si Chen Zhichao Yuan Lilei Ye Johan Liu
Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center, S Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center, S Shangda Rui Hu Microsystem Integration Technology Co.Ltd, Room 101, Science &Technology Building, Sh Smart High Tech AB, Fysikgrand 3, 41296 Gothenburg, SWEDEN Key Laboratory of Advanced Display and System Applications, Ministry of Education and SMIT Center, S
国际会议
上海
英文
1053-1055
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）