Research on Heat Dissipation of High Heat Flux Multi-Chip GaN-Based White LED Lamp

摘要：

In this paper, a novel thermal management method of vapor chamber printed circuit board coupled with sunflower heat sink is presented. The finite element method thermal analysis module of a 110 W multi-chip GaN-based white LED lamp is developed by ANSYS parametric design language and user interface design language, the thermal performance of the LED lamp thus can be analyzed more quickly and efficiently. The simulation results indicate that the overall design of the heat dissipation structure of the LED lamp is reasonable and the effect of heat dissipation is effective and satisfactory, the vapor chamber has higher heat transfer ability, and the sunflower heat sink is perfect for the heat dissipation of multi-chip LED lamp. Therefore, VCPCB coupled with sunflower heat sink is a powerful way for heat dissipation of high heat flux multi-chip GaN-based white LED lamps.

作者: Fengze Hou Daoguo Yang G.Q.Zhang Dongjing Liu

作者单位: School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin, 5 School of Mechanical & Electrical Engineering, Guilin University of Electronic Technology, Guilin, 5

会议类型: 国际会议

会议名称: 2011 12th International Conference on Electronic Packaging Technology & High Density Packaging(2011 电子封装技术与高密度封装国际会议)

会议地点: 上海

会议语种:英文

页码: 1101-1105

在线出版日期: 2011-08-08（万方平台首次上网日期，不代表论文的发表时间）