Effects of Die-attach Materials on the Optical Durability and Thermal Performances of HP-LED
Die interconnection layer is one of the main factors to improve the HP-LED thermal issue as it is the main thermal transfer media from the HP-LED chip to the substrate or heat sink. Silver epoxy is now widely used for LED interconnection, but it becomes more and more difficult for efficient heat dissipation as the HP-LED electric power density becomes higher and higher. Nowadays more and more attentions have been moved to metallic eutectic interconnection, especially for solder paste and AuSn20 eutectic interconnection which have big potential to be used for HP-LED. In order to further understand the thermal characteristics and reliability of HP-LED interconnected by different die-attach materials, the AuSn20 eutectic, solder paste and silver epoxy were applied to HP-LED respectively. The transient thermal resistance, steady state junction temperature and optical durability of the HP-LEDs are tested and studied. For HP-LED interconnected by AuSn20 eutectic, solder paste and silver epoxy, when applied 450 mA working current, the transient thermal resistance of die attach layer are 2.5 K/W, 3.2 K/W and 4 K/W respectively, and the junction temperature variation are 0.4%, 9.6% and 6.6% respectively after about 1180 hours 85 ℃/85 H aging. The results show the AuSn20 eutectic has better thermal performances and optical durability than the solder paste and silver epoxy.
Luqiao Yin Lianqiao Yang Guangming Xu Huafeng Yan Yu Chen Weiqiao Yang Shuzhi Li Jianhua Zhang
Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Educat Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Educat Shanghai Yaming Lighting co., Ltd.P.O.B 143, 149 Yanchang Rd., Shanghai University, Shanghai 200072, Shanghai Research Center of Engineering and Technology for Semiconductor Lighting Key Laboratory of Advanced Display and System Applications (Shanghai University), Ministry of Educat
国际会议
上海
英文
1116-1119
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）