Die Bonding of Single Emitter Semiconductor Laser with Nano-Scale Silver Paste
One of the most important steps in the manufacturing of laser diodes is bonding the chip onto some sort of sub-mount that allows the laser to be handled, durable electrical connections to be made, and heat to be conducted away from the laser itself. The ability to conduct heat away from the laser is critical in keeping operating temperatures low, thus improving the lasers performance and its lifetime. In this study, its the first time to use nano-scale silver paste as a die-attach material for die bonding the laser diodes. Numerous tests have been carried out to check the silver paste packaged lasers performance, including electrical properties, spectral properties, far-field characteristics, thermal rollover characteristics and so on. The test results show that as a new interconnecting material, nano-silver paste has the potential to eliminate the deficiencies of the existing solders.
Yi Yan Xu Chen XingSheng Liu Guo-Quan Lu
School of Chemical Engineering and Technology, Tianjin University, Tianjin, P.R.China State Key Laboratory of Transient Optics and Photonics，Xian Institute of Optics and Precision Mecha Department of Material Science and Engineering, Virginia Tech, USA Tianjin Key Laboratory of Advance
国际会议
上海
英文
1143-1147
2011-08-08（万方平台首次上网日期，不代表论文的发表时间）