The Role of Short Pulse High Intensity Lasers in Material Surface Properties Modification and MEMS Manufacturing
High Intensity Short Pulse Lasers (HISPLs) provide high intensity ranges (I≥GW/cm2) enabling advanced not commonly developed applications in laser materials processing involving either ablation processes or shock wave thermo-mechanical treatments. Additionally, HISPLs have proven to provide especially low thermal affectation regimes in all kind of materials (especially metals) and are considered as especially suitable tools for fine Laser materials processing applications. The specificity of the interaction regimes provided by the use of these lasers has deserved intensive study on the temporal dynamics and wavelength domains in order to predict their actual effects. In most occasions, either the fast interaction through electronic populations and/or the generation of plasma origin non-conventional energy transmission modes deserving detailed analysis for the prospects of process controllability. However, in view of their exceptional properties, the use of these lasers is clearly expanding and providing new solutions for critical laser-processing applications. In the present paper, three particular applications developed at CLUPM will be reported as illustrative examples of the capabilities of this kind of devices.
J.L.Ocana M.Morales J.A.Porro C.Molpeceres J.J.Garcia-Ballesteros D.Iordachescu M.Diaz L. Ruiz de Lara C.Correa
Centro Laser UPM. Universidad Politecnica de Madrid
国际会议
1st International Conference on Frontiers of Laser Processing(第一届激光加工前沿国际会议 ICFL 2011)
长春
英文
31-32
2011-07-11（万方平台首次上网日期，不代表论文的发表时间）