Densification Mechanism of the Low Temperature Co-Fired Glass-Ceramic Substrate
In this paper, application of multilayered circuit substrates has been studied, the glass ceramic (50%Al2O3-50%glass) with low temperature co-fired and good performance as the raw material was used, by means of calculating the apparent activation energy of densification in the experiment and observing the SEM images of glass ceramic substrate section, the densification mechanism of glass ceramic substrate sintering is analyzed.
Qing He Zhiting Geng
School of Energy Power and Mechanical Engineering, University of North China Electric Power, Beijing School of Energy Power and Mechanical Engineering, University of North China Electric Power, Beijing
国际会议
长沙
英文
122-125
2011-06-30(万方平台首次上网日期,不代表论文的发表时间)