Ultra precision Machining Technique of InSb Substrate Material for Detector Devices
Indium antimony(InSb) is one of the important materials which can be used to make semiconductor devices such as infrared detection device. Due to the low hardness and great brittleness, the surface scratching always appears and surface roughness is hard to lower during surface preparation. So it should be increasing the InSb surface quality during ultra precision machining. In this paper the InSb surface adsorption-control technology was introduced. Through controlling surface roughness during chemical mechanical polishing(CMP) and using preferential adsorption during cleaning, the adsorptions of InSb surface were controlled. Through experiments, the CMP optimal process parameters under the alkaline conditions were gotten. Under such conditions, the preferable surface state was realized. According to the preferential adsorption model, through using FA/0 non-ionic surfactant the polished wafer surface can be kept in physical adsorption and easy cleaning state, so the wafer surface adsorption can be controlled effectively and the clean surface was obtained.
Xinhuan Niu Yangang He Baohong Gao Baimei Tan Yuling Liu
Institute of Microelectronics, Hebei University of Technology, Tianjin, 300130,China
国际会议
哈尔滨
英文
1137-1140
2011-03-26（万方平台首次上网日期，不代表论文的发表时间）