Aging Behavior of Cu-Ni-Si Alloy Processed by High-Pressure Torsion
An age-hardenable Cu-2.9%Ni-0.6%Si alloy was subjected to high-pressure torsion. Aging behavior was investigated in terms of hardness, electrical conductivity and microstructural features. Transmission electron microscopy showed that the grain size is refined to～150 nm and the Vickers microhardness was significantly increased through the HPT process. Aging treatment of the HPT-processed alloy led to a further increase in the hardness. Electrical conductivity is also improved with the aging treatment. It was confirmed that the simultaneous strengthening by grain refinement and fine precipitation is achieved while maintaining high electrical conductivity. Three dimensional atom probe analysis revealed that fine precipitates with sizes of ~20 nm or smaller were formed in the Cu matrix and some particles consist of Ni and Si with no appreciable amount of Cu.
Hirotaka Matsunaga Zenji Horita Kazutaka lmamura Takanobu Kiss Xavier Sauvage
Department of Materials Science and Engineering,Faculty of Engineering,Kyushu University,Fukuoka 819 Department of Electrical Engineering,Graduate School of Information Science and Electrical Engineeri University of Rouen,CNRS UMR 6634,Groupe de Physique des Materiaux,Faculte des Sciences,BP 12,76801
国际会议
5th International Conference on Nanomaterials by Severe Plastic Deformation(第五届剧烈塑性变形纳米材料国际会议)
南京
英文
307-312
2011-03-01（万方平台首次上网日期，不代表论文的发表时间）