High Strength and Electrical Conductivity of UFG Copper Alloys
Copper based materials are still the most attractive low resistivity materials for microelectronics and electrotechnics applications, though, all variants developed to combine strength and conductivity, such as solid solutions and composites, suffer from decay in electric conductivity while strength is increased. In a addition, linear decay was also conjectured for pure copper when grain size is refined below the UFG and nanostructured domains (except when grain boundaries are pure twins). Copper alloys with low content of silver and chromium were prepared by high pressure torsion (HPT) with various annealing conditions. Vickers hardness and electric resistivity in the temperature range of 4K-340K, were measured as well as microstructural characterizations were performed using quantitative X-ray diffraction. Depending on the annealing conditions the alloys exhibit from 25% to 75% of IACS electric conductivity at room temperature and hardness in the range of 200 Hv. Origins of both high strength and high electric conductivity were investigated from microstructures analysis, using transmission electron microscopy and mechanical testing.
Y.Champion J-P Couzinie S.Tusseau-Nenez Y.Brechet R.K.Islamgaliev R.Z.Valiev
ICMPE,University Paris-Est Creteil,CNRS,2-8 rue Henri Dunant,94320 Thiais,France INP Grenoble,SIMaP 1130 rue de la Piscine,B.P.75 38402 Saint Martin dHeres Cedex,France Institute of Physics of Advanced Materials,Ufa State Aviation Technical University,12 K.Marx St.,Ufa
国际会议
5th International Conference on Nanomaterials by Severe Plastic Deformation(第五届剧烈塑性变形纳米材料国际会议)
南京
英文
755-759
2011-03-01（万方平台首次上网日期，不代表论文的发表时间）