Investigation on Corrosion Behaviors of Ultra-Fine Grain Copper in 3.5% NaCI Solution
The corrosion behavior of ultra-fine grain (UFG) copper bulk prepared by equal channel angular pressing (ECAP) was studied in 3.5% NaCI solution. The effect of ECAP deformation on the copper corrosion is controversial in the literature, and worth to verify by means of various experimental techniques. Corrosion performances of UFG copper were investigated in comparison with that in recrystallized coarse grain (CG) copper by polarization curves, Tafel extrapolation method, electrochemical impedance spectroscopy(EIS). The shape of polarization curves and type of corrosive attack remains the same in the UFG and the coarsegrain state. UFG copper exhibited a lower corrosion current and high self-corrosion potential in comparison with CG copper. Electrochemical experimental results showed that UFG copper increased in resistance to corrosion compared with CG copper. This decrease in corrosion resistance was mainly attributed to the more compact corrosion film of UFG copper. The compact passive film led to decrease of the diffusion capability of ions within the corrosion film and corrosion rate.
Qingjuan Wang Y.C.Wang Zhongze Du Xiaoyan Liu
School of Metallurgy engineering,Xian University of Architecture &Technology,Xian,China
国际会议
5th International Conference on Nanomaterials by Severe Plastic Deformation(第五届剧烈塑性变形纳米材料国际会议)
南京
英文
1125-1130
2011-03-01（万方平台首次上网日期，不代表论文的发表时间）