High temperature deformation behavior and microstructure preparation of Cu-Ni-Si-P alloy
The hot deformation behavior of Cu-Ni-Si-P alloy have been investigated by means of isothermal compression tests on a Gleeble-1500D thermal-mechanical simulator in the temperature ranges of 873-1073 K and strain rate ranges of 0.01-5s -1. The results show that the dynamic recryatallization occurs in Cu-Ni-Si-P alloy during hot deformation. The peak stress during hot deformation can be described by the hyperbolic sine function. The influence of deformation temperature and strain rate on the peak stress can be represented using the Zener-Hollomon parameter. Moreover, the activation energy for hot deformation of Cu-Ni-Si-P alloy is determined to be 485.6 kJ /mol within the investigated ranges of deformation temperature and strain rate. The constitutive equation of the Cu-Ni-Si-P alloy is also established.
Zhang Yi Liu Ping Tian Bao-hong Chen Xiao-hong Jia Shu-guo Li Dejun
Department of Materials Science and Engineering, Henan University of Science and Technology, Luoyang Department of Mechanical Engineering, University of ShangHai for Science and Technology, Shanghai 20 Department of Materials Science and Engineering, Henan University of Science and Technology, Luoyang Department of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China
国际会议
桂林
英文
1-7
2010-11-16（万方平台首次上网日期，不代表论文的发表时间）