Computer analysis of superplastic sheet forming at the lowered temperatures
temperatures. Eugene N. Chumachenko, Sergey A. Aksenov Moscow state institute of electronics and mathematics (technical university) 109028, Russia, Moscow, MIEM www.kommek.ru , mmkaf@miem.edu.ru On the basis of experimental data obtained the three-dimensional computer approximation of mechanical characteristics of VT6 alloy was constructed. It was made in a broad range of temperatures and strain rate, taking account of strain hardening and structure parameter affect. Tension tests of workpieces were carried on up to the breaking point. Experimental laboratory studies of the material mechanical properties show that the temperature of industrial superplastic forming can be lowered. A developed mathematical model is proposed and enables to calculate an optimum pressurization taking into account the structural state of the shell material and principles of the shell friction on the die surface. The calculated pressurization enables to obtain the optimum superplastic properties of the material in the preset area of the deformed shell. The proposed model has been tested experimentally. In laboratory conditions, forming of special workpieces with calculated pressurization has been conducted. The experimental researchers confirm theoretical forecasts concerning a ability of alloy VT6 to decrease the forming temperature of SPF. According to the designed method the theoretical forecasts of industrial shells formchanging in flight vehicles were computerised. The calculation for optimization of manufacturing parts of a jet plane flanks apply a method of superplastic gaseous forming compatible with a diffusion boundary is implemented. The studies have been made with the support of the international company AIRBUS GIE and the firm KOMMEK Ltd (Russia) and the Russian state federal program (№ P225).
Eugene N.Chumachenko Sergey A.Aksenov
Moscow state institute of electronics and mathematics (technical university)109028, Russia, Moscow, Moscow state institute of electronics and mathematics (technical university) 109028, Russia, Moscow,
国际会议
桂林
英文
1
2010-11-16（万方平台首次上网日期，不代表论文的发表时间）