会议专题

The numerical simulation of conductive body forming process and mould design

T2-copper conductive body is a important part used in high voltage switch, it has poor machining process due to the complex shape. Through Deform numerical simulation, conductive body was formed by open-die forging and closed die forging. In the open-die forging simulation ,heat transfer coefficient between blank(880 ℃) and open-die (200 ℃)is 11, the surrounding environment temperature is 20 ℃, friction factor is 0.3. The main open-die forging process parameters is: outer draft angle α=6.5°; inner draft angle β=10°; bridge width b=5 、8 、11mm. punching skin and cylindrical blank. Simulation results show that forging can meet the requirement while properly adjusting mould parameters. The main size of closed-die forging working parts is designed according to the conductive body graph, no draft angle and ring blank of external diameter Φ 111mm and inside diameter Φ 93mm with the same volume of conductive body. The simulation results shows that forging can be formed using open-die forging, and it is difficult to form product by the process of the closed-die forging for ring blank because of the restriction of solid state metal liquidity, many regions of the filling is not sufficient. Open-die forging and casting blank-closed die forging are both used in actual production. The casting blank -closed die forging is a more reasonable forming process compared with the open-die forging as metal volume of distribution is solved, higher utilization rate of material, more simple process in following work and the like. To make it more suitable for practical production, appropriate adjustments of some parameters was made in the mold design process based on the numerical simulation.

Gao jianxin Zhao peifeng Song kexing Wang qing

School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 47 School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048,China

国际会议

The 6th International Conference on Physical and Numerical Simulation of Materials Processing(第六届材料与热加工物理模拟及数值模拟国际学术会议 ICPNS 2010)

桂林

英文

1-6

2010-11-16(万方平台首次上网日期,不代表论文的发表时间)