Grinding Characteristics of Polycrystalline Silicon

摘要：

In this study, up and down surface plunge grinding tests have been carried out in polycrystalline silicon workpieces. In the tests resin bonded diamond wheels of different abrasive grain size were used under varying conditions of cutting depth and workpiece velocity. Experimental results show that the specific grinding energy decreases as the maximum undeformed chip thickness increases regardless of abrasive grain sizes and modes of grinding. The surface roughness with larger grain size is greater than that with smaller one. In the case of 120 mesh grain, the magnitudes of surface roughness for up grinding are distinctly greater than those for down grinding.

作者: Young Moon Lee Eun Sil Jang Seung Gyu Jang Eun Suk Jang Seong Seok Lee Tae Gun Kwon

作者单位: School of Mechanical Engineering, Kyungpook National University, 1370 Sankyuk-Dong,Puk-Ku, Daegu, 70 Graduate School of Mechanical Engineering, Kyungpook National University, 1370 Sankyuk-Dong, Puk-Ku,

会议类型: 国际会议

会议名称: The 6th International Conference on Physical and Numerical Simulation of Materials Processing(第六届材料与热加工物理模拟及数值模拟国际学术会议 ICPNS 2010)

会议地点: 桂林

会议语种:英文

页码: 1-6

在线出版日期: 2010-11-16（万方平台首次上网日期，不代表论文的发表时间）