The evolution characteristics and numerical analysis of diffusion bonding interface structure of Titanium alloy/ Cu / Stainless steel
Carries on the investigation to the titanium alloy/Cu/stainless steel intermetallic compound of bonding interface in the meantime，to make a thermodynamic model of the interface element diffusion to have a numerical simulation of the diffusion distance and diffusion temperature, time. Using analysis methods of stretching test， microhardness test，SEM and EDS，to investigate and research the mechanical properties, the interface structure characteristic, the principal element atomic diffusion mechanism of joints thermal simulation and the vacuum diffusion bonding of Ti-6Al-4V/Cu/304, the reacting phases are produced and the distribution range. The results show that when bonding pressure is 5.0 Mpa, the joints tensile strength first increase and then decreases, with bonding temperature and time rising, When bonding temperature is 1223K, bonding time is 3.6ks, there is a maximum tensile strength that is 162.73 MPa. However, it will is disadvantageous to performance of the joints, when bonding temperature and time extended overly. But it can improve the tensile strength, When the reducing the thickness of the middle layer of copper properly. it formed multi-phase transition organizations by solid solution,intermetallic compounds in the bonding interface，such as Ti2Cu，TixCuy tie, Ti2Fe, TiFe2 and TiFe. Effect of TixFey on strength of the joints is slightly inferior the TixCuy compound. The fracture is mainly by the titanium alloy side region Ⅲ for the source dehiscence, developping in the weak diffusion layer. The thermal simulation diffusion bonding has certain superiority, saving time and cost. The theory analysis has certain guiding meaning to the practice.
By LIU Shuying XU Kuan LIU Guangbao CAO Congzong HENG zhonghao
Henan University of Science and Technology, school of materials Science and Engineering Henan Provin Suzhou Hailu Heavy Industry Co., Ltd, Jiangsu, Zhangjiagang 215600 Henan Technician College of Economics and Business, Department of Electrical and Electronic,Henan, X Henan University of Science and Technology, school of materials Science and Engineering
国际会议
桂林
英文
1-6
2010-11-16（万方平台首次上网日期，不代表论文的发表时间）