Separation of Copper Foils and Base Plates from Waste Printed Circuit Boards by Chemical Swelling Method
In this paper, ten kinds of chemical solvents were used to immerse the waste printed circuit boards (PCBs). Comparing the effects of chemical swelling solvents on the peeling strength between copper foils and base plates from PCBs, solvent D, solvent F, acetone and water were selected as the typical chemical swelling solvents. After chemical swelling treatment, the monomer liberation degree and scrapping time were further investigated to obtain particles with certain size distribution. The experimental results showed that scrapping after chemical swelling treatment could remarkably increase the monomer liberation degree of metals. The chemical swelling effects of the four solvents were in the sequence solvent D>solvent F>acetone>water. The longer time and higher temperature favored the decrease of peeling strength between copper foils and base plates from PCBs. The copper foils could fall off from the base plates spontaneously after immersing in solvent D at 150 ℃ for 3 h or at 140 ℃ for 5 h. This study demonstrated that chemical swelling treatment was very conductive to achieve higher monomer liberation degree of metals with coarser particle sizes.
Hong-bin CAO Xi-hua ZHANG Hong-liang LIU
Research Centre for Process Pollution Control, Key Laboratory of Green Process and Engineering, Institute of Process Engineering,Chinese Academy of Sciences, Beijing, China
国际会议
The Fifth International Conference on Waste Management and Technology(第五届固体废物管理与技术国际会议)
北京
英文
309-313
2010-11-01（万方平台首次上网日期，不代表论文的发表时间）