Study on the Stress Field in Ultrasonic Grinding Engineering Ceramics

摘要：

The mechanical model of stress field was established in grinding with/without ultrasonic vibration assistance, based on indentation fracture mechanics. Compared with the stress field in conventional grinding, the research has shown that the grinding stress field changes periodically with the vibration process of the moving grains in ultrasonic grinding. In a vibration cycle, the grains interfere with the workpiece within the time of T+Δt and cut off the material from the workpiece surface. Meantime, the large impact force between the grinding wheel and the workpiece results in stress field on the ground surface. In other period of vibration cycle, the grains are detached from the workpiece surface, and there exists no interaction between them. The grinding force disappears, so does the grinding stress field.

作者: Xiaobo Wang Huiqin Gao Guofu Gao

作者单位: Henan Polytechnic University, Jiaozuo, China, 454003 Hebei University of Science and Technology, Shi Hebei University of Science and Technology, Shijiazhuang, China, 050018 Henan Polytechnic University, Jiaozuo, China, 454003

会议类型: 国际会议

会议名称: 第八届中日机械技术史及机械设计国际会议

会议地点: 河南焦作

会议语种:英文

页码: 1-5

在线出版日期: 2010-10-31（万方平台首次上网日期，不代表论文的发表时间）