Experimental and FEM Research on Drop Tests of Electronic Devices
The ability of electronic devices, such as personal digital assistants and digital cameras,to withstandaccidental impacts and shock is essential. In this paper, two research methods on a whole-packagedscanners ability of shock are employed. One is the experimental test in accordance with GB/T4857.5-92about transport packages-vertical impact test method by dropping. During the test, the data acquisition deviceobtains useful data from strain gauges and acceleration sensors. To avoid the disadvantages of the experimentalmethod, the finite element method is also conducted. An advanced analytical simulation for the variousdrop orientations is performed to evaluate the structural performance of the product and demonstrate theircompliance with regulatory requirements. Comparisons show good correlation between experimental and finiteelement methods. In addition, this paper intends to provide some guidance on the research of packagingperformance of electronic products.
Li Xingzhou Zhang Guoqiang Dong Daokun
The Department of Packaging Engineering, Shandong University Jinan, China
国际会议
The 17th IAPRI World Conference on Packaging(第17届世界包装大会)
天津
英文
145-149
2010-10-12(万方平台首次上网日期,不代表论文的发表时间)