Spectrum Analysis for Tool Vibration Involved in Diamond Turning of Single Crystal Silicon

摘要：

For the sake of investigating the relationship between the distribution of tool vibration spectrum and the cutting parameters in diamond turning of single crystal silicon, molecular dynamics simulation and a series of diamond turning experiments were carried out on the crystalline plane (100) of single crystal silicon with a rounded diamond cutting tool in this work. The evolution mechanism of tool vibration spectrum was analysed deeply. The simulation and experiment results indicate that the distribution of tool vibration spectrum is heavily dependent on not only the contact mode between tool and silicon wafer, but also the micro/nano removal mode of single crystal silicon. The smaller cutting velocity and the greater cutting thickness generate the much more high frequency of tool vibration spectrum in ductile regime cutting. It is helpful to select the reasonable cutting parameters to reduce the overall vibration of cutting system.

作者: ZHANG Jian-guo ZONG Wen-jun ZHANG Jun-jie SUN Tao

作者单位: Centre for Precision Engineering, Harbin Institute of Technology, Harbin 150001,China

会议类型: 国际会议

会议名称: 2nd International Conference on Nanomanufacturing，1st CIRP Conference on Nanomanufacturing(第二届纳米制造国际会议)

会议地点: 天津

会议语种:英文

页码: 1-4

在线出版日期: 2010-09-24（万方平台首次上网日期，不代表论文的发表时间）