An Ultra-Wideband Vertical Transition from Microstrip to Stripline in PCB Technology

摘要：

An ultra-wideband transition from microstrip to stripline in PCB technology is presented applying only through via holes for simple fabrication. The design is optimized using full-wave EM simulations. A prototype is manufactured and measured achieving a return loss better than 8.7 dB and an insertion loss better than 1.2 dB in the FCC frequency range. A meander-shaped delay line in stripline technique is presented as an example of application.

作者: Mario Leib Michael Mirbach Wolfgang Menzel

作者单位: University of Ulm, Microwave Techniques, Albert-Einstein-Allee 41, 89081 Ulm, Germany

会议类型: 国际会议

会议名称: 2010国际超宽带会议(ICUWB 2010)

会议地点: 南京

会议语种:英文

页码: 1-4

在线出版日期: 2010-09-20（万方平台首次上网日期，不代表论文的发表时间）